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Extra info for Advanced millimeter-wave technologies : antennas, packaging and circuits
The fact that most of today’s systems and packages are based on discrete components, with individually tuned connection in between, slows down the time to market for such systems. 4 Reliability Great emphasis must be placed on system reliability. The reliability of an electronic system, consisting of a group of components, is the probability of operating continuously over a specific period of time with no failure. The reliability is expressed in percent. Component failure rates are strongly dependent on temperature and vibration.
Second, silicon IC surfaces are passivated with a thick layer of polyimide for reasons of reliability to prevent oxidation of the metal stack. This makes on-chip passives less sensitive to additional IC encapsulation materials. The top surfaces of MMICs, however, are usually not covered by passivation materials and passive devices need to be carefully remodeled to account for the electromagnetic properties of the encapsulation materials. 11: Split-block package housing. Reproduced by permission of © IBM.
See Chapter 17 for more details about the modeling of such transitions. 14: PCB design rule example. 4 Emerging Packaging Technologies Packaging technologies are changing rapidly to adopt to emerging markets, innovation and technology. Many new acronyms and abbreviations are being created and details about the fabrication process are often proprietary to a specific vendor. This section reviews only exemplary emerging packaging technologies. 1 Microcoaxial Wirebonds – Bridgewave Microcoaxial wirebonds have demonstrated the ability to handle frequencies up to 100 GHz .